pb rohs eh1120ettts-4.000m eh11 20 et t ts -4.000m series rohs compliant (pb-free) 5.0v 14 pin dip metal thru-hole hcmos/ttl high frequency oscillator frequency tolerance/stability 20ppm maximum package operating temperature range -40c to +85c nominal frequency 4.000mhz pin 1 connection tri-state (high impedance) duty cycle 50 5(%) electrical specifications nominal frequency 4.000mhz frequency tolerance/stability 20ppm maximum (inclusive of all conditions: calibration tolerance at 25c, frequency stability over the operation temperature range, supply voltage change, output load change, 1st year aging at 25c, shock, and vibration) aging at 25c 5ppm/year maximum operating temperature range -40c to +85c supply voltage 5.0vdc 10% input current 50ma maximum (no load) output voltage logic high (voh) 2.4vdc minimum with ttl load, vdd-0.4vdc minimum with hcmos load (ioh = -16ma) output voltage logic low (vol) 0.4vdc maximum with ttl load, 0.5vdc maximum with hcmos load (iol = +16ma) rise/fall time 6nsec maximum (measured at 0.8vdc to 2.0vdc with ttl load, 20% to 80% of waveform with hcmos load) duty cycle 50 5(%) (measured at 50% of waveform with ttl load or with hcmos load) load drive capability 10ttl load or 50pf hcmos load maximum output logic type cmos pin 1 connection tri-state (high impedance) tri-state input voltage (vih and vil) +2.2vdc minimum to enable output, +0.8vdc maximum to disable output (high impedance), no connect to enable output. absolute clock jitter 250psec maximum, 100psec typical one sigma clock period jitter 50psec maximum, 30psec typical start up time 10msec maximum storage temperature range -55c to +125c environmental & mechanical specifications fine leak test mil-std-883, method 1014, condition a gross leak test mil-std-883, method 1014, condition c lead integrity mil-std-883, method 2004 mechanical shock mil-std-202, method 213, condition c resistance to soldering heat mil-std-202, method 210 resistance to solvents mil-std-202, method 215 solderability mil-std-883, method 2003 temperature cycling mil-std-883, method 1010 vibration mil-std-883, method 2007, condition a www.ecliptek.com | specification subject to change without notice | rev c 3/11/2011 | page 1 of 7
eh1120ettts-4.000m mechanical dimensions (all dimensions in millimeters) pin connection 1 tri-state (high impedance) 7 ground/case ground 8 output 14 supply voltage line marking 1 ecliptek 2 eh11ts eh11=product series 3 4.000m 4 xxyzz xx=ecliptek manufacturing code y=last digit of the year zz=week of the year www.ecliptek.com | specification subject to change without notice | rev c 3/11/2011 | page 2 of 7 marking orient a tion 7.620 0.203 13.2 max 20.8 max 15.240 0.203 1 7 8 14 dia 0.457 0.100 (x4) 5.08 min 5.08 max 0.9 max output disable (high imped ance st a te) output w a veform & timing dia gram v oh v ol 80% or 2.0v dc 50% or 1.4v dc 20% or 0.8v dc f all time rise time t w t duty cycle (%) = t w /t x 100 v ih v il t plz t pzl clock output tri-st a te input
eh1120ettts-4.000m www.ecliptek.com | specification subject to change without notice | rev c 3/11/2011 | page 3 of 7 supply v oltage (v dd ) t est cir cuit f or ttl output output no connect or t r i-state ground + + + + _ _ _ _ p o w er supply v oltage meter current meter 0.01 f (note 1) 0.1 f (note 1) c l (note 3) r l (note 4) p o w er supply oscilloscope f requency counter probe (note 2) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . note 4: resistance v alue r l is sho wn in t ab le 1. see applicab le specification sheet f or 'load dr iv e capability'. note 5: all diodes are mmbd7000, mmbd914, or equiv alent. t ab le 1: r l resistance v alue and c l capacitance v alue vs . output load dr iv e capability output load drive capability r l v alue (ohms) c l v alue (pf) 10ttl 5ttl 2ttl 10lsttl 1ttl 390 780 1100 2000 2200 15 15 6 15 3
eh1120ettts-4.000m www.ecliptek.com | specification subject to change without notice | rev c 3/11/2011 | page 4 of 7 supply v oltage (v dd ) t est cir cuit f or cmos output output no connect or t r i-state ground + + + _ _ _ p o w er supply 0.01 f (note 1) 0.1 f (note 1) c l (note 3) note 1: an e xter nal 0.1 f lo w frequency tantalum b ypass capacitor in par allel with a 0.01 f high frequency cer amic b ypass capacitor close to the pac kage g round and v dd pin is required. note 2: a lo w capacitance (<12pf), 10x atten uation f actor , high impedance (>10mohms), and high bandwidth (>300mhz) passiv e probe is recommended. note 3: capacitance v alue c l includes sum of all probe and fixture capacitance . v oltage meter current meter oscilloscope f requency counter probe (note 2)
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eh1120ettts-4.000m high temperature solder bath (wave solder) ts max to tl (ramp-up rate) 3c/second maximum preheat - temperature minimum (ts min) 150c - temperature typical (ts typ) 175c - temperature maximum (ts max) 200c - time (ts min) 60 - 180 seconds ramp-up rate (tl to tp) 3c/second maximum time maintained above: - temperature (tl) 217c - time (tl) 60 - 150 seconds peak temperature (tp) 260c maximum for 10 seconds maximum target peak temperature (tp target) 250c +0/-5c time within 5c of actual peak (tp) 20 - 40 seconds ramp-down rate 6c/second maximum time 25c to peak temperature (t) 8 minutes maximum moisture sensitivity level level 1 additional notes temperatures shown are applied to back of pcb board and device leads only. do not use this method for product with the gull wing option. www.ecliptek.com | specification subject to change without notice | rev c 3/11/2011 | page 5 of 7
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eh1120ettts-4.000m low temperature infrared/convection 185c ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 60 - 120 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 185c maximum target peak temperature (tp target) 185c maximum 2 times time within 5c of actual peak (tp) 10 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 additional notes temperatures shown are applied to body of device. use this method only for product with the gull wing option. www.ecliptek.com | specification subject to change without notice | rev c 3/11/2011 | page 6 of 7
t min s t max s critical zone t to t l p ramp-up ramp-down t l t p t 25 c to peak t preheat s t l t p temperature (t) time (t) recommended solder reflow methods eh1120ettts-4.000m low temperature solder bath (wave solder) ts max to tl (ramp-up rate) 5c/second maximum preheat - temperature minimum (ts min) n/a - temperature typical (ts typ) 150c - temperature maximum (ts max) n/a - time (ts min) 30 - 60 seconds ramp-up rate (tl to tp) 5c/second maximum time maintained above: - temperature (tl) 150c - time (tl) 200 seconds maximum peak temperature (tp) 245c maximum target peak temperature (tp target) 245c maximum 1 time / 235c maximum 2 times time within 5c of actual peak (tp) 5 seconds maximum 1 time / 15 seconds maximum 2 times ramp-down rate 5c/second maximum time 25c to peak temperature (t) n/a moisture sensitivity level level 1 additional notes temperatures shown are applied to back of pcb board and device leads only. do not use this method for product with the gull wing option. low temperature manual soldering 185c maximum for 10 seconds maximum, 2 times maximum. (temperatures listed are applied to device leads only. this method can be utilized with both gull wing and non-gull wing devices.) high temperature manual soldering 260c maximum for 5 seconds maximum, 2 times maximum. (temperatures listed are applied to device leads only. this method can be utilized with both gull wing and non-gull wing devices.) www.ecliptek.com | specification subject to change without notice | rev c 3/11/2011 | page 7 of 7
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